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Dive Brief:
- Construction has begun on a massive megaproject, made up of teams from three major American contractors. Micron Technology poured the first concrete for its $100 billion semiconductor campus in Clay, New York, according to July 9 press releases from the company and contractor Gilbane.
- The milestone marks the transition from site preparation for vertical construction for the project that also includes Jacobs and Bechtel, more than a quarter ahead of the original schedule, according to Gilbane.
- The chipmaker, in partnership with Gilbane, has directed about $675 million, more than half of the total value awarded to date, to New York-based contractors, suppliers and subcontractors, according to Micron’s statement.
Diving knowledge:
The first concrete pour comes about a month later Micron played Bechtel as the engineering, procurement and construction partner for the first phase of the project.
Gilbane has overseen preconstruction since August 2025, when the Providence, Rhode Island-based contractor won the contract to prepare the land for the site. Jacobs is the architectural design and engineering partner, according to Micron.
Once complete, the campus will be the largest semiconductor manufacturing site in U.S. history, according to the chipmaker. The campus will consist of up to four fabs, according to Micron, and will support the chip giant’s goal of producing 40% of its DRAM in the US.
“Today’s milestone marks another important step for Micron in Central New York, and what makes it even more remarkable is that we are here in July, months ahead of schedule, pouring the concrete foundation,” New York Governor Kathy Hochul said in Micron’s press release. “This is the largest private investment in the history of New York State.”
The chipmaker also laid out its plan US investment from $200 billion to more than $250 billion by 2035, according to the company’s press release. The New York campus is the cornerstone of this investment plan, although additional investments will also be made at its site in Boise, Idaho. According to the release, Micron expects first wafer production at its first Idaho plant in mid-2027 and late 2028 for the second plant.
