SK hynix Inc.’s Advanced Packaging Stack and High Bandwidth Memory (HBM) R&D Center. in West Lafayette, Indiana, started in April and is ongoing. The project is one of many bringing advanced semiconductor chip manufacturing to the US
SK hynix, based in Icheon, South Korea, says it is investing about $3.8 billion in the facility, which would be its first manufacturing site outside Asia. The $1.9 billion project was the second-largest non-residential project in the United States to break ground in April, according to the Dodge Construction Network.
The work is being done at home. Contractor Hi-Tech Engineering Partners is leading work on the project, according to a spokesman for the owner. Records show the company is a subsidiary of SK Inc., a subsidiary of the project’s owner.
The 133.5-acre site where the plant is being built is located in the Purdue Research Park. SK hynix announced its site selection in April 2024 along with Purdue University. Later that year, the US Department of Commerce provided $458 million in direct funding and $500 million in loans to support the project from the $53 billion fund created by Congress in the CHIPS and Science Act of 2022.
20.9
The percentage increase in manufacturing construction begins in 12 months and ends in April
Source: Dodge Construction Network
SK hynix joins a growing list of manufacturers in the area, which Chad Pittman, president and CEO of the Purdue Research Foundation, attributes to a matter of trust.
“These companies are making multi-decade decisions, and they need to know that the people, the state and the university will be reliable partners for the long term,” he said. “We understood very quickly that global companies aren’t just looking for incentives, they’re looking for ecosystems.”
